Thermomechanical vibration of PCB and component assembly

Ayda Halouani (1) , Mariem Miladi Chaabane (2) , Mohamed Haddar (2) , Abel Cherouat (1, 3)

1 Gamma3 - Automatic mesh generation and advanced methods
2 ENIS - École Nationale d'Ingénieurs de Sfax | National School of Engineers of Sfax
3 UTT - Université de Technologie de Troyes

This study investigates the effect of vibration loading. A tow dimensional finite element model of the printed circuit board (PCB) and the plastic ball grid array (PBGA) component assembly is released to investigate the effect of harmonic excitation on the solder ball response.

Domaines: Sciences de l'ingénieur [physics]

Ayda Halouani, Mariem Miladi Chaabane, Mohamed Haddar, Abel Cherouat. Thermomechanical vibration of PCB and component assembly. Second International Conference on Acoustics and Vibration, Mar 2018, Hammamet, Tunisia. ⟨hal-02572200⟩