BCB Based Packaging for Low Actuation Voltage RF MEMS Devices

David Peyrou (1) , Fabienne Pennec (2) , Hikmat Achkar (1) , Patrick Pons (2) , Fabio Coccetti (3) , Hervé Aubert (2) , Robert Plana (2)

1 LAAS-M2D
2 LAAS-MINC - Équipe MIcro et Nanosystèmes pour les Communications sans fil
3 LAAS-II

This paper outlines the issues related to RF MEMS packaging and low actuation voltage. An original approach is presented concerning the modeling of capacitive contacts using multiphysics simulation and advanced characterization. A similar approach is used concerning packaging development where multi-physics simulations are used to optimize the process. A devoted package architecture is proposed featuring very low loss at microwave range.

Mots clés: multiphysics simulation; RF MEMS; Packaging

Domaines: Mécanique des structures [physics.class-ph]; Mécanique des structures [physics.class-ph]; Electromagnétisme; Thermique [physics.class-ph]; Thermique [physics.class-ph]

David Peyrou, Fabienne Pennec, Hikmat Achkar, Patrick Pons, Fabio Coccetti, et al.. BCB Based Packaging for Low Actuation Voltage RF MEMS Devices. Materials Research Society Symposia Proceedings, 2006, pp.7. ⟨hal-00172967⟩