Abstract : This paper proposes a new method to determine the Young modulus from high temperature bending test. Considering that the global behaviour of experimental device and sample is purely elastic during the unload phase and exploiting that the effects of the indentation under the contact are lower at the beginning of the unloading, it is proposed to deduce the Young's modulus from the slope of the unloading curve. Young modulus obtained with this method for different SiC based refractories are in good agreement with results of others tests such as tensile test or ultrasonic measurement.
https://hal.archives-ouvertes.fr/hal-00567765
Contributor : Eric Blond <>
Submitted on : Monday, November 12, 2018 - 8:20:13 AM Last modification on : Monday, February 15, 2021 - 10:47:23 AM Long-term archiving on: : Wednesday, February 13, 2019 - 1:36:26 PM
Emmanuel de Bilbao, Eric Blond, Claire Michel, Thierry Cutard, N. Schmitt, et al.. A new method to determine the Young's modulus of refractory materials. Interceram, 2010, 59 (1), pp.34-38. ⟨hal-00567765⟩