Mechanical Study of Copper Bonded at Low Temperature Using Spark Plasma Sintering Process

Bassem Mouawad (1) , Maher Soueidan (1, 2) , D. Fabregue (3) , Cyril Buttay (1) , Vincent Bley (4) , Bruno Allard (1)

1 AMPERE - Ampère
2 lebanese Atomic Energy Commission
3 MATEIS - Matériaux, ingénierie et science [Villeurbanne]
4 LAPLACE-MDCE - Matériaux Diélectriques dans la Conversion d’Energie

Bonding of high purity polished copper was investigated using the Spark Plasma Sintering technique (SPS) showing the effect of SPS parameters (surface roughness, time, temperature and pressure) on the bonding strength behaviour. Mechanical characterization of the bonded samples was performed at room temperature using tensile test. Two surfaces roughnesses were studied (un-polished and polished samples). It was found that the bonding strength varied from 50 MPa to 233 MPa for un-polished and polished surfaces respectively The tensile strength of the used bulk copper-rod was found to be 365 MPa, while most results are over 122 MPa (a third of the bulk value).

Mots clés: Copper bonding; Spark Plasma Sintering; Tensile test

Domaines: Energie électrique

Bassem Mouawad, Maher Soueidan, D. Fabregue, Cyril Buttay, Vincent Bley, et al.. Mechanical Study of Copper Bonded at Low Temperature Using Spark Plasma Sintering Process. Advanced Materials Research, 2011, 324, pp.177-180. ⟨10.4028/www.scientific.net/AMR.324.177⟩. ⟨hal-00799899⟩