Electrochemical Behavior of Magnetron-Sputtered Al-Cu Alloy Films in Sulfate Solutions - Université Toulouse III - Paul Sabatier - Toulouse INP Accéder directement au contenu
Article Dans Une Revue Journal of The Electrochemical Society Année : 2007

Electrochemical Behavior of Magnetron-Sputtered Al-Cu Alloy Films in Sulfate Solutions

Résumé

Model alloys, generated by magnetron sputtering, have been employed to understand the role of copper on the corrosion behavior of aluminum alloys. Binary Al-Cu alloys, with copper contents between 0 and 100 atom %, were synthesized with well-controlled compositions, embracing single-phase alpha and theta alloys together with multiphase alloys. Electrochemical measurements confirmed the stability of the thin alloy films and revealed that the corrosion behavior of the alpha, theta, and eta2 phases differed strongly in the cathodic region. Further, in the anodic region, phases of high copper content suffered pitting in sulfate solutions, while the alpha phase remained passive.

Domaines

Matériaux
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Dates et versions

hal-00806052 , version 1 (29-03-2013)

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Jonathan Idrac, Christine Blanc, Yolande Kihn, Marie-Christine Lafont, Georges Mankowski, et al.. Electrochemical Behavior of Magnetron-Sputtered Al-Cu Alloy Films in Sulfate Solutions. Journal of The Electrochemical Society, 2007, vol. 154, pp.C286-C293. ⟨10.1149/1.2719623⟩. ⟨hal-00806052⟩
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