Silver oxalate-based solders: New materials for high thermal conductivity microjoining

Kateryna Kiryukhina (1) , Hoa Le Trong (1) , Philippe Tailhades (1) , Jacques Lacaze (1) , Valérie Baco-Carles (1) , Michel Gougeon (1) , Frédéric Courtade (2) , Sophie Dareys (2) , Olivier Vendier (3) , Lidwine Raynaud (3)

1 CIRIMAT - Centre interuniversitaire de recherche et d'ingenierie des matériaux
2 CNES - Centre National d'Études Spatiales [Toulouse]
3 TAS - Thales Alenia Space [Toulouse]

Micrometric oxalate powders can be decomposed starting from temperatures as low as 90°C, leading to the formation of temporary nanometric grains of metallic silver with a high propensity for sintering. The decomposition being highly exothermic, this additional energy favours the sintering, i.e. the soldering, process. Solders processed at 300°C and very low pressure (<0.5 MPa) displayed a thermal conductivity close to 100 W m-1 K-1, making silver oxalate very promising for safe, moderate temperature and very low pressure bonding.

Mots clés: Silver oxalate; Microelectronic packaging; Joining; Soldering; Thermal conductivity

Domaines: Matériaux; Matériaux et structures en mécanique [physics.class-ph]; Matériaux et structures en mécanique [physics.class-ph]

Kateryna Kiryukhina, Hoa Le Trong, Philippe Tailhades, Jacques Lacaze, Valérie Baco-Carles, et al.. Silver oxalate-based solders: New materials for high thermal conductivity microjoining. Scripta Materialia, 2013, vol. 68, pp.623-626. ⟨10.1016/j.scriptamat.2012.12.018⟩. ⟨hal-00832138⟩