Skip to Main content Skip to Navigation
Journal articles

New bonded assembly configuration for dynamic mechanical analysis of adhesives

Abstract : A new sample configuration has been developed in order to study molecular mobility of an adhesive in a bonded assembly configuration by dynamic mechanical analysis. The torsional rectangular mode is used to provide a shear solicitation all along the adherend/adhesive interface. The initial mechanical properties of each assembly's constituent are first investigated as reference. The modulus of aluminum foils used as substrates exhibits a classic elastic component and a slight viscous part due to microstructural changes or stress relaxation. Four relaxation modes are highlighted and identified for epoxy adhesive tested as a bulk material. Its viscoelastic behavior is compared to the one of adhesive tested in assembly configuration. The relaxation modes of the adhesive remain visible in spite of the sample stiffening by aluminum foils. Relaxation modes comparison shows that the temperature of loss modulus associated with the mechanical manifestation of glass transition slightly increases for the assembly configuration. Energy losses during this relaxation are much higher in the assembly configuration. Influence of rigid aluminum substrates is discussed in terms of the adhesively bonded joint solicitation mode.
Document type :
Journal articles
Complete list of metadata

Cited literature [48 references]  Display  Hide  Download

https://hal.archives-ouvertes.fr/hal-00840784
Contributor : Open Archive Toulouse Archive Ouverte (oatao) <>
Submitted on : Wednesday, July 3, 2013 - 10:41:19 AM
Last modification on : Monday, January 4, 2021 - 10:24:03 AM
Long-term archiving on: : Friday, October 4, 2013 - 4:07:35 AM

File

causse_9198.pdf
Files produced by the author(s)

Identifiers

Collections

Citation

Nicolas Causse, Luis Quiroga Cortes, Eric Dantras, Claire Tonon, Mathieu Chevalier, et al.. New bonded assembly configuration for dynamic mechanical analysis of adhesives. International Journal of Adhesion and Adhesives, Elsevier, 2013, vol. 46, pp.1-6. ⟨10.1016/j.ijadhadh.2013.05.011⟩. ⟨hal-00840784⟩

Share

Metrics

Record views

364

Files downloads

1044