Aging of shielding joints, shielding performance and corrosion, International Zurich Symposium and Technical Exhibition on Electromagnetic Compatibility, 2005. ,
Influence of aging and environnement conditions on EMC performances of electronic equipment ? Influence of passive vs active components, EMC Europe, 2010. ,
URL : https://hal.archives-ouvertes.fr/hal-01158677
Microelectronics Reliability: Physics-of-Failure Based Modeling and Lifetime Evaluation ,
Characterization of the Evolution of IC Emissions After Accelerated Aging, IEEE Transactions on Electromagnetic Compatibility, vol.51, issue.4, pp.4-892, 2009. ,
DOI : 10.1109/TEMC.2009.2033577
URL : https://hal.archives-ouvertes.fr/hal-00669519
Impact of NBTI on EMC behaviours of CMOS inverter, 2010 Asia-Pacific International Symposium on Electromagnetic Compatibility, 2010. ,
DOI : 10.1109/APEMC.2010.5475776
Impact of aging on the immunity of a mixed-signal circuit, EMC Europe, 2010. ,
Construction and Evaluation of the Susceptibility Model of an Integrated Phase-Locked Loop, 8th International Workshop on electromagnetic Compatibility of Integrated Circuits, 2011. ,
URL : https://hal.archives-ouvertes.fr/hal-00669716
Clocking in Modern VLSI Systems, pp.978-979, 2009. ,
DOI : 10.1007/978-1-4419-0261-0
IC-EMC user's manual version 2.0, 2009. ,
Future IEC 62433-4: integrated circuit ? EMC IC Modelling ? Part 4: ICIM-CI, integrated circuit immunity model, conducted immunity, 2008. ,
Design-in-Reliability Approach for NBTI and Hot-Carrier Degradations in Advanced Nodes, IEEE Transactions on Device and Materials Reliability, vol.7, issue.4, 2007. ,
DOI : 10.1109/TDMR.2007.911380
Electronic circuit reliability modeling, Microelectronics Reliability, vol.46, issue.12, pp.9-11, 2006. ,
DOI : 10.1016/j.microrel.2005.12.004
Study of the impact of hot carrier injection to immunity of MOSFET to electromagnetic interferences, 22nd European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, 2011. ,
DOI : 10.1016/j.microrel.2011.06.010
URL : https://hal.archives-ouvertes.fr/hal-00669726
CADless laser assisted methodologies for failure analysis and device reliability, Microelectronics Reliability, vol.50, issue.9-11, pp.1236-1240, 2010. ,
DOI : 10.1016/j.microrel.2010.07.131
URL : https://hal.archives-ouvertes.fr/hal-00988334