Enthalpy relaxation phenomena of epoxy adhesive in operational configuration: Thermal, mechanical and dielectric analyses

Nicolas Causse 1 Eric Dantras 1 Claire Tonon 2 Mathieu Chevalier 2 Hélène Combes 3 Pascale Guigue 3 Colette Lacabanne 1
1 CIRIMAT - Centre interuniversitaire de recherche et d'ingenierie des matériaux
2 Astrium [Toulouse]
3 CNES - Centre National d'Études Spatiales [Toulouse]
Abstract : Thermal cycling in space environment can cause physical aging of polymers used in structural adhesive bonded joint. Later, they can initiate failure. A methodology to follow physical aging effects on their thermal, mechanical and dielectric properties is applied to a commercial epoxy adhesive. The analytic description, using Tool, Narayanaswamy and Moynihan model gives a good description of the enthalpy relaxation. It is completed by a phenomenological analysis of the evolution of the adhesive thermal transitions, mechanical properties and mo- lecularmobility. Testedsamples with bondedassembly are representative ofin servicecon fi gurations. The in fl u- ence of physical aging on the adhesive and the associated bonded assemblies is analyzed.
Keywords : Physical aging Adhesively bonded joint Epoxy Enthalpy relaxation Mechanical and dielectric relaxations
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Journal articles
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Nicolas Causse, Eric Dantras, Claire Tonon, Mathieu Chevalier, Hélène Combes, et al.. Enthalpy relaxation phenomena of epoxy adhesive in operational configuration: Thermal, mechanical and dielectric analyses. Journal of Non-Crystalline Solids, Elsevier, 2014, vol. 387, pp. 57-61. ⟨10.1016/j.jnoncrysol.2013.12.028⟩. ⟨hal-00950219⟩

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