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Journal articles
Enthalpy relaxation phenomena of epoxy adhesive in operational configuration: Thermal, mechanical and dielectric analyses
Abstract : Thermal cycling in space environment can cause physical aging of polymers used in structural adhesive bonded joint. Later, they can initiate failure. A methodology to follow physical aging effects on their thermal, mechanical and dielectric properties is applied to a commercial epoxy adhesive. The analytic description, using Tool, Narayanaswamy and Moynihan model gives a good description of the enthalpy relaxation. It is completed by a phenomenological analysis of the evolution of the adhesive thermal transitions, mechanical properties and mo- lecularmobility. Testedsamples with bondedassembly are representative ofin servicecon fi gurations. The in fl u- ence of physical aging on the adhesive and the associated bonded assemblies is analyzed.
Cited literature [34 references]
https://hal.archives-ouvertes.fr/hal-00950219
Contributor : Open Archive Toulouse Archive Ouverte (oatao) <>
Submitted on : Friday, February 21, 2014 - 10:11:20 AM
Last modification on : Monday, January 4, 2021 - 10:24:03 AM
Long-term archiving on: : Wednesday, May 21, 2014 - 10:51:31 AM
Contributor : Open Archive Toulouse Archive Ouverte (oatao) <>
Submitted on : Friday, February 21, 2014 - 10:11:20 AM
Last modification on : Monday, January 4, 2021 - 10:24:03 AM
Long-term archiving on: : Wednesday, May 21, 2014 - 10:51:31 AM
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