Mechanical stress induced by electromagnetic forces on wire bonds of high power modules

Hassen Medjahed (1) , Paul-Etienne Vidal (1) , Jean-Marc Dienot (2) , Bertrand Nogarède (3)

1 LGP - Laboratoire Génie de Production
2 Labceem - Laboratoire contraintes électromagnétiques et électronique mobile
3 LAPLACE - LAboratoire PLasma et Conversion d'Energie

This paper concerns the analytical determination and experimental characterization of electromagnetic forces exerted on high power IGBT wire bonds.

Mots clés: Wire bonding; Electromagnetic forces; Mechanical stress

Domaines: Electromagnétisme

Hassen Medjahed, Paul-Etienne Vidal, Jean-Marc Dienot, Bertrand Nogarède. Mechanical stress induced by electromagnetic forces on wire bonds of high power modules. EuroEm 2012 (European Electromagnetics), Jul 2012, Toulouse, France. pp. 1-1. ⟨hal-00975195⟩