Design and Manufacturing of a Double-Side Cooled, SiC based, High Temperature Inverter Leg

Raphaël Riva (1) , Cyril Buttay (1) , Marie-Laure Locatelli (2) , Vincent Bley (2) , Bruno Allard (1)

1 EE - Ampère, Département Energie Electrique
2 LAPLACE-MDCE - Matériaux Diélectriques dans la Conversion d’Energie

In this paper, we present a small (25x25x3 mm 3 ) power module that integrates two silicon-carbide (SiC) JFETs to form an inverter leg. This module has a sandwich" structure, i.e. the power devices are placed between two ceramic substrates, allowing for heat extraction from both sides of the dies. All interconnects are made by silver sintering, which offers a very high temperature capability (the melting point of pure silver being 961 °C). The risk of silver migration is assessed, and we show that Parylene-HT, a dielectric material that can sustain more than 300 °C, can completely coat the module, providing adequate protection.

Mots clés: JFET; silver migration; silver sintering; 3-D packaging; sandwich module

Domaines: Energie électrique

Raphaël Riva, Cyril Buttay, Marie-Laure Locatelli, Vincent Bley, Bruno Allard. Design and Manufacturing of a Double-Side Cooled, SiC based, High Temperature Inverter Leg. HiTEC 2014, May 2014, Albuquerque, United States. pp.THA27. ⟨hal-00997365⟩