EDT for Power Devices

Cyril Buttay (1) , Chenjiang Yu (2) , Eric Labouré (2) , Vincent Bley (3) , Céline Combettes (4)

1 EE - Ampère, Département Energie Electrique
2 GeePs - Laboratoire Génie électrique et électronique de Paris
3 LAPLACE-MDCE - Matériaux Diélectriques dans la Conversion d’Energie
4 LAPLACE - LAboratoire PLasma et Conversion d'Energie

This presentation gives an overview of the packaging requirements for power electronics, especially in terms of thermal aspects. Then, it briefly describes the state-of-the-art in the topic of advanced Printed-Circuit-Board (PCB) use in power electronics. Finally, the embedding technology developed in the 3DPHI platform is presented

Domaines: Sciences de l'ingénieur [physics]

Cyril Buttay, Chenjiang Yu, Eric Labouré, Vincent Bley, Céline Combettes. EDT for Power Devices. Embedded Device Technology: “Disappearing Die – Embed your Chips”, IMAPS - NMI, Sep 2016, Caldicot, United Kingdom. ⟨hal-01373062⟩