Design / technology co-optimization of strain-induced layout effects in 14nm UTBB-FDSOI CMOS: Enablement and assessment of continuous-RX designs
Résumé
We report on the main local layout effect in 14nm Ultra-Thin Buried oxide and Body Fully Depleted Silicon On Insulator (UTBB-FDSOI) CMOS technology [1]. This effect is demonstrated by Nano-Beam Diffraction to be directly induced by the strain in the SiGe channel and reproduced by an accurate electrical compact model. An original continuous-RX design optimizes the stress management, maintaining longitudinal stress component while relaxing the transverse one. A 28% ring oscillator delay improvement is experimentally demonstrated at same leakage for 1-finger inverter at VDD=0.8V supply voltage and a frequency gain up to 15% is simulated in a critical path of an A9 core. © 2016 IEEE.
Mots clés
CMOS integrated circuits
Integrated circuit design
Integrated circuit layout
Integrated circuit testing
VLSI circuits
CMOS technology
Co-optimization
Delay improvements
Fully depleted silicon-on-insulator
Longitudinal stress
Nanobeam diffraction
Ring oscillator
Stress management
Silicon on insulator technology