Cracks and blisters formed close to a silicon wafer surface by He-H co-implantation at low energy

Nikolay Cherkashin (1) , Nabil Daghbouj (2, 1) , François-Xavier Darras (1) , M. Fnaiech (2) , Alain Claverie (1)

1 CEMES - Centre d'élaboration de matériaux et d'études structurales
2 FSM - Faculté des Sciences de Monastir

We have studied the effect of reducing the implantation energy towards low keV values on the areal density of He and H atoms stored within populations of blister cavities formed by co-implantation of the same fluence of He then H ions into Si(001) wafers and annealing. Using a variety of experimental techniques, we have measured blister heights and depth from the surface, diameter, areal density of the cracks from which they originate as functions of implantation energy and fluence. We show that there is a direct correlation between the diameters of the cracks and the heights of the associated blisters. This correlation only depends on the implantation energy, i.e., only on the depth at which the cracks are located. Using finite element method modeling, we infer the pressure inside the blister cavities from the elastic deformations they generate, i.e., from the height of the blisters. From this, we demonstrate that the gas pressure within a blister only depends on the diameter of the associated crack and not on its depth position and derive an analytical expression relating these parameters. Relating the pressure inside a blister to the respective concentrations of gas molecules it contains, we deduce the areal densities of He and H atoms contained within the populations of blisters. After low-energy implantations (8 keV He+, 3 keV H+), all the implanted He and H atoms contribute to the formation of the blisters. There is no measurable exo-diffusion of any of the implanted gases, in contrast to what was assumed at the state of the art to explain the failure of the Smart-Cut technology when using very low energy ion implantation for the fabrication of ultra-thin layers. Alternative explanations must be investigated.

Mots clés: Atoms; Cracks; Finite element method; Silicon wafers; Analytical expressions; Experimental techniques; Finite element method models; Implantation energies; Low energy implantation; Low energy ion implantation; Silicon wafer surface; Smart cut technology; Ion implantation

Domaines: Physique [physics]

Nikolay Cherkashin, Nabil Daghbouj, François-Xavier Darras, M. Fnaiech, Alain Claverie. Cracks and blisters formed close to a silicon wafer surface by He-H co-implantation at low energy. Journal of Applied Physics, 2015, 118 (24), pp.245301 - 135308. ⟨10.1063/1.4938108⟩. ⟨hal-01719496⟩