R. D. Adams, L. Silva, A. Ochsner, and R. Adams, Non destructive testing Handbook of adhesion technology, pp.1049-69, 2011.

R. Adams and B. Drinkwater, Nondestructive testing of adhesively-bonded joints, NDT & E International, vol.30, issue.2, pp.93-101, 1997.
DOI : 10.1016/S0963-8695(96)00050-3

A. Baker, J. Gunnion, and J. Wang, On the Certification of Bonded Repairs to Primary Composite Aircraft Components, The Journal of Adhesion, vol.67, issue.1-2, pp.4-38, 2015.
DOI : 10.1520/STP36314S

B. Gao, W. Woo, and G. Tian, Electromagnetic Thermography Nondestructive Evaluation: Physics-based Modeling and Pattern Mining, Scientific Reports, vol.14, issue.4, p.25480, 2016.
DOI : 10.1109/TIP.2011.2156801
URL : http://www.nature.com/articles/srep25480.pdf

D. Palumbo and U. Galietti, Damage Investigation in Composite Materials by Means of New Thermal Data Processing Procedures, Strain, vol.5, issue.5, pp.276-85, 2016.
DOI : 10.1080/17686733.2014.891324

F. Lopez, C. Ibarra-castanedo, D. P. Nicolau, V. Maldague, and X. , Optimization of pulsed thermography inspection by partial least-squares regression, NDT & E International, vol.66, pp.128-166, 2014.
DOI : 10.1016/j.ndteint.2014.06.003

M. Barus, H. Welemane, F. Collombet, M. Pastor, A. Cantarel et al., Bonded repair issues for composites: An investigation approach based on infrared thermography, NDT & E International, vol.85, pp.27-33, 2017.
DOI : 10.1016/j.ndteint.2016.10.003
URL : https://hal.archives-ouvertes.fr/hal-01490599

R. Adams, The nondestructive evaluation of bonded structures, Construction and Building Materials, vol.4, issue.1, pp.3-8, 1990.
DOI : 10.1016/0950-0618(90)90011-O

D. Yan, B. Drinkwater, and S. Neild, Measurement of the ultrasonic nonlinearity of kissing bonds in adhesive joints, NDT & E International, vol.42, issue.5, pp.459-66, 2009.
DOI : 10.1016/j.ndteint.2009.02.002

A. Germaneau, P. Doumalin, and J. Dupr-e, Comparison between X-ray micro-computed tomography and optical scanning tomography for full 3D strain measurement by digital volume correlation, NDT & E International, vol.41, issue.6, pp.407-422, 2008.
DOI : 10.1016/j.ndteint.2008.04.001

S. Nielsen, H. Poulsen, F. Beckmann, C. Thorning, and J. Wert, Measurements of plastic displacement gradient components in three dimensions using marker particles and synchrotron X-ray absorption microtomography, Acta Materialia, vol.51, issue.8, pp.2407-2422, 2003.
DOI : 10.1016/S1359-6454(03)00053-3

D. Ju-arez, S. Ferrand, O. Fenollar, V. Fombuena, and R. Balart, Improvement of thermal inertia of styrene???ethylene/butylene???styrene (SEBS) polymers by addition of microencapsulated phase change materials (PCMs), European Polymer Journal, vol.47, issue.2, pp.153-61, 2011.
DOI : 10.1016/j.eurpolymj.2010.11.004

W. Zhou, S. Qi, Q. An, H. Zhao, and N. Liu, Thermal conductivity of boron nitride reinforced polyethylene composites, Materials Research Bulletin, vol.42, issue.10, pp.1863-73, 2007.
DOI : 10.1016/j.materresbull.2006.11.047

B. Zhu, J. Ma, J. Wu, K. Yung, and C. Xie, Study on the properties of the epoxy-matrix composites filled with thermally conductive AlN and BN ceramic particles, Journal of Applied Polymer Science, vol.91, issue.5, pp.2754-64, 2010.
DOI : 10.1002/app.32673

P. Germain, Q. Nguyen, and P. Suquet, Continuum Thermodynamics, Journal of Applied Mechanics, vol.50, issue.4b, pp.1010-1030, 1983.
DOI : 10.1115/1.3167184
URL : https://hal.archives-ouvertes.fr/hal-00105630

J. Li, P. Xue, W. Ding, J. Han, and G. Sun, Micro-encapsulated paraffin/high-density polyethylene/wood flour composite as form-stable phase change material for thermal energy storage, Solar Energy Materials and Solar Cells, vol.93, issue.10, pp.1761-1768, 2009.
DOI : 10.1016/j.solmat.2009.06.007

S. Das, N. Putra, and W. Roetzel, Temperature Dependence of Thermal Conductivity Enhancement for Nanofluids, Journal of Heat Transfer, vol.16, issue.4, pp.567-74, 2003.
DOI : 10.1007/BF01441907

H. Xie, J. Wang, T. Xi, Y. Liu, A. F. Wu et al., Thermal conductivity enhancement of suspensions containing nanosized alumina particles, Journal of Applied Physics, vol.432, issue.7, pp.4568-72, 2002.
DOI : 10.1115/1.2822665

W. Zhou, S. Qi, C. Tu, H. Zhao, C. Wang et al., Effect of the particle size of Al2O3 on the properties of filled heat-conductive silicone rubber, Journal of Applied Polymer Science, vol.120, issue.2, pp.1312-1320, 2007.
DOI : 10.1002/app.25789

K. Gaska, A. Rybak, C. Kapusta, R. Sekula, and A. Siwek, A study of thermal conductivity of boron-nitride epoxy-matrix composite, Proceeding of EECM-15 conference, 2012.

G. Lee, M. Park, J. Kim, J. Lee, and H. Yoon, Enhanced thermal conductivity of polymer composites filled with hybrid filler, Composites Part A: Applied Science and Manufacturing, vol.37, issue.5, pp.727-761, 2006.
DOI : 10.1016/j.compositesa.2005.07.006

Y. Xu and D. Chung, Increasing the thermal conductivity of boron nitride and aluminum nitride particle epoxy-matrix composites by particle surface treatments, Composite Interfaces, vol.7, issue.4, pp.243-56, 2000.
DOI : 10.1111/j.1151-2916.1991.tb04325.x

D. Marchio and P. Reboux, Introduction aux transferts thermiques. Paris: Mines ParisTech Les Presses " Les cours de l' ecole des mines, p.210, 2008.
URL : https://hal.archives-ouvertes.fr/hal-00509343