Low stress polyimide multilayers integration for flexible substrate

Samuel Charlot (1) , Valentina Castagnola (2) , Emeline Descamps (2)

1 LAAS-TEAM - Service Techniques et Équipements Appliqués à la Microélectronique
2 LAAS-NBS - Équipe NanoBioSystèmes

Materials integration in flexible substrate to do foldable and bending MEMS or electronics devices seems to be required for a lot of applications. That's why; we present here a simple fabrication process flow to make polyimide (PI) devices easily peelable from a rigid support host. Besides the PI flexible device keeps its original aspect thanks to the hygroscopic character of the carrier [1]. The advantage of this process is its simplicity of implementation on a support host without sacrificial layer. It makes it possible to control roughness, deposited thickness, and also to limit the constraints between various materials.

Domaines: Sciences de l'ingénieur [physics]; Micro et nanotechnologies/Microélectronique

Samuel Charlot, Valentina Castagnola, Emeline Descamps. Low stress polyimide multilayers integration for flexible substrate. Smart System Integration, Mar 2014, Vienne, Austria. 4p. ⟨hal-01869404⟩