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COMPARISON OF THICK COPPER PLATING RESULTS WITH LABORATORY AND INDUSTRIAL ELECTROPLATING TOOLS

David Bourrier 1 Arnaud Durlach 1
1 LAAS-TEAM - Service Techniques et Équipements Appliqués à la Microélectronique
LAAS - Laboratoire d'analyse et d'architecture des systèmes
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https://hal.laas.fr/hal-01873753
Contributor : David Bourrier <>
Submitted on : Thursday, September 13, 2018 - 3:43:09 PM
Last modification on : Friday, January 10, 2020 - 9:10:10 PM

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  • HAL Id : hal-01873753, version 1

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David Bourrier, Arnaud Durlach. COMPARISON OF THICK COPPER PLATING RESULTS WITH LABORATORY AND INDUSTRIAL ELECTROPLATING TOOLS. Journées Nationales sur les Technologies Emergentes en micro-nanofabrication (JNTE 2017), Oct 2017, Orléans, France. 1p., 2017. ⟨hal-01873753⟩

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