Low cost integration of multilevel lab-on-a-chip using a new generation of dry film photoresists

Rémi Courson (1) , Sébastien Cargou (2) , Véronique Conédéra (1) , Marc Fouet (2) , Anne Marie Gué (2)

1 LAAS-TEAM - Service Techniques et Équipements Appliqués à la Microélectronique
2 LAAS-N2IS - Équipe Nano Ingénierie et Intégration des Systèmes

We present the use of a novel dry film photoresist DF-1050 (EMS) for the integration of multilevel microfluidic systems. We showed that high resolution and high aspect ratio (7:1) can be achieved for free standing structures. We proved also that the dry film autofluorescence level is compatible with most of lab-on-a-chip applications and established the biocompatibility of this dry film. Ultimately, we demonstrated that this low-cost material combined with multilevel lamination technology would allow introducing massively 3D microfluidic in lab-on-a-chip devices.

Domaines: Micro et nanotechnologies/Microélectronique; Matériaux; Polymères; Chimie inorganique

Rémi Courson, Sébastien Cargou, Véronique Conédéra, Marc Fouet, Anne Marie Gué. Low cost integration of multilevel lab-on-a-chip using a new generation of dry film photoresists. Smart Systems Integration, Mar 2014, Vienne, Austria. 8p. ⟨hal-01875311⟩