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Article Dans Une Revue Microelectronics Reliability Année : 2017

Gate leakage-current analysis and modelling of planar and trench power SiC MOSFET devices in extreme short-circuit operation

Résumé

The purpose of this paper is to present a complete analysis of the gate leakage-current behaviour during short-circuit (SC) fault operation of 1200V SiC MOSFETs from five different manufacturers including planar and trench-gate structures. Ruggedness and gate leakage level are evaluated in function of the chip size. Finally, the gate leakage current is modelled and the robustness tested.
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Dates et versions

hal-02180620 , version 1 (11-07-2019)

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François Boige, Frédéric Richardeau. Gate leakage-current analysis and modelling of planar and trench power SiC MOSFET devices in extreme short-circuit operation. Microelectronics Reliability, 2017, 76-77, pp.532-538. ⟨10.1016/j.microrel.2017.06.084⟩. ⟨hal-02180620⟩
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