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Communication Dans Un Congrès Année : 2019

Ceramic substrates for high voltage power electronics: past, present and future

Résumé

In the present work, we report a review of the ceramic substrate technologies used for high voltage power electronics modules. These technologies will be confronted with the different challenges undertaken to improve the properties of the ceramic substrate, from thermal, mechanical and dielectric performance point of view. We describe some of the current developments on the design of substrate both from the architecture and from the material points of view. In particular, a new strategy on the design and realization of a ceramic substrate based on aluminum nitride is presented.
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Dates et versions

hal-02357174 , version 1 (09-11-2019)

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Zarel Valdez Nava, Driss Kenfaui, Marie-Laure Locatelli, Lionel Laudebat, Sophie Guillemet. Ceramic substrates for high voltage power electronics: past, present and future. 2019 IEEE International Workshop on Integrated Power Packaging (IWIPP), Apr 2019, Toulouse, France. pp.91-96, ⟨10.1109/IWIPP.2019.8799084⟩. ⟨hal-02357174⟩
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