Double side interconnection for vertical power components based on macro and nano structured copper interfaces and printed circuit board technologies

Bojan Djuric (1, 2) , Vincent Bley (3) , Julien Morand (1) , Olivier Dagut (2) , Jean-Pascal Cambronne (3) , Stefan Mollov (4)

1 MERCE-France - Mitsubishi Electric R&D Centre Europe [France]
2 LAPLACE - LAboratoire PLasma et Conversion d'Energie
3 LAPLACE-MDCE - Matériaux Diélectriques dans la Conversion d’Energie
4 MERCE-France - Mitsubishi Electric R&D Centre Europe [France]

This paper describes a full copper Z-axis interconnection manufacturing for vertical power electronic components. The approach is a combination of a die embedding in a PCB and interconnections by macro post overlaid with nano wires, ensuring both electrical and thermal connection of the die.

Mots clés: Power electronics; power module; switch; active component; 3D integration; PCB-embedding; interconnection; electroplating; macro; nano

Domaines: Electronique; Micro et nanotechnologies/Microélectronique

Bojan Djuric, Vincent Bley, Julien Morand, Olivier Dagut, Jean-Pascal Cambronne, et al.. Double side interconnection for vertical power components based on macro and nano structured copper interfaces and printed circuit board technologies. MiNaPAD, May 2019, Grenoble, France. ⟨hal-02545171⟩