Temporary adhesives for wafer bonding: deep reactive ion etching application

David Colin (1) , Djaffar Belharet (1) , Pascal Dubreuil (1) , Laurent Mazenq (1) , Hugues Granier (1)

1 LAAS-TEAM - Service Techniques et Équipements Appliqués à la Microélectronique

Domaines: Matériaux; Sciences de l'ingénieur [physics]

David Colin, Djaffar Belharet, Pascal Dubreuil, Laurent Mazenq, Hugues Granier. Temporary adhesives for wafer bonding: deep reactive ion etching application. European Microelectronics and Packaging Conference (EMPC 2009), Jun 2009, Rimini, Italy. ⟨hal-03167904⟩