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hal-02324471v1  Conference papers
F. MortreuilC. Villeneuve-FaureL. BoudouK. MakashevaG. Teyssedre. Charges injection investigation at metal/dielectric interfaces by Kelvin Probe Force Microscopy
2016 IEEE International Conference on Dielectrics (ICD), Jul 2016, Montpellier, France. pp.493-496, ⟨10.1109/ICD.2016.7547650⟩
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hal-02324432v1  Conference papers
C. Villeneuve-FaureG. TeyssedreS. Le RoyL. BoudouK. Makasheva. Interface properties in dielectrics: A cross-section analysis by atomic force microscopy
2018 12th International Conference on the Properties and Applications of Dielectric Materials (ICPADM), May 2018, Xi'an, China. pp.1135-1138, ⟨10.1109/ICPADM.2018.8401246⟩
hal-01936829v1  Poster communications
Clotilde BoudotCyril FersingJulien PedronValere Belle MbouCaroline Castera-Ducros et al.  New nitroaromatic candidats for trypanosomiasis therapeutics.
Congress ICOPA (14th International Congress of Parasitology), Aug 2018, Daegu, South Korea
hal-02005747v1  Conference papers
M. AzibF. BaudoinC. Villeneuve-FaureG. TeyssedreNicolas Binaud et al.  Numerical Simulations for Sensitivity Analysis of the Electrostatic Force Curve on Charge Localization in 3D
2018 IEEE 2nd International Conference on Dielectrics (ICD), Jul 2018, Budapest, France. pp.1-4
hal-02396181v1  Conference papers
M. AzibF. BaudoinC. Villeneuve-FaureG. TeyssedreN. Binaud et al.  Numerical Simulations for Sensitivity Analysis of the Electrostatic Force Curve on Charge Localization in 3D
2018 IEEE 2nd International Conference on Dielectrics (ICD), Jul 2018, Budapest, France. pp.1-4, ⟨10.1109/ICD.2018.8514685⟩
hal-01962590v1  Journal articles
Jérémy CureK. PiettreAlix Sournia-SaquetYannick CoppelJ. Esvan et al.  A novel method for the metallization of 3D silicon induced by metastable copper nanoparticles
ACS Applied Materials & Interfaces, Washington, D.C. : American Chemical Society, 2018, 10 (38), pp.32838-32848. ⟨10.1021/acsami.8b09428⟩