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hal-02324471v1  Conference papers
F. MortreuilC. Villeneuve-FaureL. BoudouK. MakashevaG. Teyssedre. Charges injection investigation at metal/dielectric interfaces by Kelvin Probe Force Microscopy
2016 IEEE International Conference on Dielectrics (ICD), Jul 2016, Montpellier, France. pp.493-496, ⟨10.1109/ICD.2016.7547650⟩
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hal-02324432v1  Conference papers
C. Villeneuve-FaureG. TeyssedreS. Le RoyL. BoudouK. Makasheva. Interface properties in dielectrics: A cross-section analysis by atomic force microscopy
2018 12th International Conference on the Properties and Applications of Dielectric Materials (ICPADM), May 2018, Xi'an, China. pp.1135-1138, ⟨10.1109/ICPADM.2018.8401246⟩
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hal-02940233v1  Conference papers
M. SoumboA. ScarangellaC. Villeneuve-FaureC. BonafosC. Roques et al.  Combined effect of proteins and AgNPs on the adhesion of yeast Candida albicans on solid silica surfaces
2020 IEEE 20th International Conference on Nanotechnology (IEEE-NANO), Jul 2020, Montreal, Canada. pp.242-245, ⟨10.1109/NANO47656.2020.9183494⟩