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hal-01962590v1  Journal articles
Jérémy CureK. PiettreAlix Sournia-SaquetYannick CoppelJ. Esvan et al.  A novel method for the metallization of 3D silicon induced by metastable copper nanoparticles
ACS Applied Materials & Interfaces, Washington, D.C. : American Chemical Society, 2018, 10 (38), pp.32838-32848. ⟨10.1021/acsami.8b09428⟩