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hal-00528039v1  Journal articles
S. BrandstetterV. CarreauS. MaitrejeanM. VerdierMarc Legros. Grain morphology of Cu damascene lines
Microelectronic Engineering, Elsevier, 2010, 87 (3), pp.383-386. ⟨10.1016/j.mee.2009.05.033⟩