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hal-01415096v1  Journal articles
Sangkil KimAtif ShamimApostolos GeorgiadisHervé AubertManos M. Tentzeris. Fabrication of Fully Inkjet-Printed Vias and SIW Structures on Thick Polymer Substrates
IEEE Transactions on Components, Packaging and Manufacturing Technology. Part A, Manufacturing Technology, Institute of Electrical and Electronics Engineers (IEEE), 2016, 6 (3), pp.486-496