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hal-01373062v1  Conference papers
Cyril ButtayChenjiang YuEric LabouréVincent BleyCéline Combettes. EDT for Power Devices
Embedded Device Technology: “Disappearing Die – Embed your Chips”, IMAPS - NMI, Sep 2016, Caldicot, United Kingdom
hal-01168805v1  Journal articles
Yannick BeynetAntoine IzouletSophie Guillemet-FritschGeoffroy ChevallierVincent Bley et al.  ZnO-based varistors prepared by spark plasma sintering
Journal of the European Ceramic Society, Elsevier, 2015, vol. 35 (n° 4), pp. 1199-1208. ⟨10.1016/j.jeurceramsoc.2014.10.007⟩
hal-00707782v1  Journal articles
Bassem MouawadMaher SoueidanD. FabrègueCyril ButtayVincent Bley et al.  Full densification of Molybdenum powders using Spark Plasma Sintering
Metallurgical and Materials Transactions A, Springer Verlag/ASM International, 2012, pp.1-8. ⟨10.1007/s11661-012-1144-2⟩
hal-01207014v1  Journal articles
Bassem MouawadBenoit ThollinCyril ButtayLaurent DupontVincent Bley et al.  Direct Copper Bonding for Power Interconnects: Design, Manufacturing, and Test
IEEE Transactions on Components, Packaging and Manufacturing Technology. Part A, Manufacturing Technology, Institute of Electrical and Electronics Engineers (IEEE), 2015, 5 (1), pp.143-150. ⟨10.1109/TCPMT.2014.2376882⟩
hal-01081697v1  Conference papers
Raphaël RivaCyril ButtayRémi PerrinMarie-Laure LocatelliVincent Bley et al.  3D Packaging Structure for High Temperature Power electronics
From Nano to Micro Power Electronics and Packaging Workshop, IMAPS France, Oct 2014, Tours, France
hal-02405800v1  Conference papers
Vincent BleyCyril ButtayDenis LabrousseMickael PetitBojan Djuric et al.  Die Interconnection for Power Module 3.0
ECPE Workshop "Power Module 2.0", Oct 2019, Hambourg, Germany
hal-01197043v1  Conference papers
Chenjiang YuCyril ButtayEric LabouréVincent BleyCéline Combettes. Highly integrated power electronic converters using active devices embedded in printed-circuit board
4th Micro/Nano-Electronics, packaging and assembling, design and manufacturing forum MiNaPAD 2015, IMAPS, Apr 2015, Grenoble, France
hal-00672244v1  Journal articles
Bassem MouawadMaher SoueidanD. FabrègueCyril ButtayBruno Allard et al.  Application of the Spark Plasma Sintering Technique to Low-Temperature Copper Bonding
IEEE Transactions on Components and Packaging Technologies, Institute of Electrical and Electronics Engineers, 2012, 2 (4), pp.553 - 560. ⟨10.1109/TCPMT.2012.2186453⟩
hal-00467493v1  Journal articles
Madona BoulosSophie Guillemet-FritschFrançois MathieuBernard DurandThierry Lebey et al.  Hydrothermal synthesis of nanosized BaTiO3 powders and dielectric properties of corresponding ceramics
Solid State Ionics, Elsevier, 2005, vol. 176 n° 13-14., 1301-1309 available on :