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hal-00938358v1  Journal articles
Alexandre BoyerSonia Ben Dhia. Effect of Aging on Power Integrity and Conducted Emission of Digital Integrated Circuits
Journal of Low Power Electronics, American Scientific Publishers, 2014, 10 (1), pp.165-172
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hal-01006119v1  Conference papers
Jian-Fei WuJiancheng LiRongjun ShenAlexandre BoyerSonia Ben Dhia. Effect of Electrical Stresses on the Susceptibility of a Voltage regulator
EMC Symposium in Europe 2013 (EMC Europe 2013), Sep 2013, Bruges, Belgium. pp.113
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hal-01006121v1  Conference papers
Alexandre BoyerSonia Ben Dhia. Effect of Electrical Stresses on Digital Integrated Circuits Power Integrity
2013 17th IEEE Workshop on Signal and Power Integrity (SPI), May 2013, Paris, France. pp.1-4
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hal-01006115v1  Conference papers
Alexandre BoyerHe HuangSonia Ben Dhia. Impact of thermal aging on emission of a buck DC-DC converter
2014 International Symposium on Electromagnetic Compatibility, Tokyo (EMC'14/Tokyo), May 2014, Tokyo, Japan. pp.77-80
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hal-01574389v1  Conference papers
Nicolas LacrampeSebastien SerpaudAlexandre BoyerSéreirath Tran. Radiated suceptibility investigation of electronic board from near field scan method
11th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2017), Jul 2017, Saint-Petersbourg, Russia. pp.125-130, ⟨10.1109/EMCCompo.2017.7998096⟩
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hal-01574376v1  Conference papers
Alexandre BoyerManuel Antero Gonzalez SentisChaimae GhfiriAndré Durier. Modeling methodology of the conducted emission of a DC-DC converter board
11th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2017), Jul 2017, Saint-Petersbourg, Russia. pp.73-78, ⟨10.1109/EMCCompo.2017.7998085⟩
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hal-01574384v1  Conference papers
Chaimae GhfiriAndré DurierChristian MarotAlexandre BoyerSonia Ben Dhia. Methodology of modeling of the internal activity of a FPGA for conducted emission prediction purpose
11th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2017), Jul 2017, Saint-Petersbourgh, Russia. 6p
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hal-01574387v2  Conference papers
Sébastien SerpaudChaimae GhfiriAlexandre BoyerA Durier. Proposal for combined conducted and radiated emission modelling for Integrated Circuit
11th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2017), Jul 2017, Saint-Petersbourg, Russia. pp.172-177, ⟨10.1109/EMCCompo.2017.7998105⟩
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hal-01159221v1  Conference papers
Marc Veljko Thomas TomasevicAlexandre BoyerSonia Ben Dhia. Development of an On-Chip Sensor for Substrate Coupling Study in Smart Power Mixed ICs
Asia-Pacific International EMC Symposium 2015, May 2015, Taipei, Taiwan. 4p
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hal-01159220v1  Conference papers
Alexandre BoyerB VrignonManuel CavarrocJ Shepherd. Near-Field Injection At Die Level
Asia-Pacific International EMC Symposium 2015, May 2015, Taipei, Taiwan
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hal-01159222v1  Conference papers
He HuangAlexandre BoyerSonia Ben DhiaBertrand Vrignon. Prediction of Aging Impact on Electromagnetic Susceptibility of an Operational Amplifier
Asia-Pacific International EMC Symposium 2015, May 2015, Taipei, Taiwan. 4p
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hal-02319460v1  Conference papers
Nabil El Belghiti AlaouiPatrick TounsiAlexandre BoyerArnaud Viard. Detecting PCB Assembly defects using infrared thermal signatures
27th International Conference Mixed Design of Integrated Circuits and Systems (MIXDES2019), Jun 2019, Wroclaw, Poland. ⟨10.23919/MIXDES.2019.8787089⟩
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hal-02319463v1  Conference papers
Alexandre Boyer. A Rigorous Method to extrapolate Radiated Susceptibility from Near-Field Scan Immunity
International Symposium on Electromagnetic Compatibility (EMC Europe 2019), Sep 2019, Barcelona, Spain
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hal-02319466v1  Conference papers
Sébastien SerpaudAlexandre BoyerSonia Ben Dhia. Sequential adaptive sampling algorithm to reduce the near field measurement time
International Symposium on Electromagnetic Compatibility (EMC Europe 2019), Sep 2019, Barcelona, Spain
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hal-02319468v1  Conference papers
Nabil El Belghiti AlaouiAnais CassouPatrick TounsiAlexandre BoyerArnaud Viard. Using infrared thermal responses for PCBA production tests: Feasibility study
30 th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2019), Sep 2019, Toulouse, France
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hal-02319469v1  Conference papers
Alexandre BoyerE. Sicard. A Case Study to apprehend RF Susceptibility of Operational Amplifiers
12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2019), Oct 2019, Haining, China
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hal-02319472v1  Conference papers
Sebastien SerpaudAlexandre BoyerSonia Ben Dhia. Optimized algorithm to reduce the near-field measurement time on FPGA device
12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2019), Oct 2019, Haining, China
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tel-02327898v1  Habilitation à diriger des recherches
Alexandre Boyer. Contribution à la caractérisation et la modélisation de la CEM des circuits intégrés
Electronique. Université Paul Sabatier - Toulouse III, 2019
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hal-00669533v1  Conference papers
Alexandre BoyerSonia Ben DhiaChristophe LemoineBertrand Vrignon. An On-Chip Sensor for Time Domain Characterization of Electromagnetic Interferences
8th Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo), Nov 2011, Dubrovnik, Croatia. pp.251
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hal-01225364v1  Conference papers
Etienne SicardAlexandre BoyerPriscillia Fernandez-LopezAn ZhouNicolas Marier et al.  EMC performance analysis of a Processor/Memory System using PCB and Package-On-Package
10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2015), Nov 2015, Edimburgh, United Kingdom. 6p
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hal-01225367v1  Conference papers
Abhishek RamanujanEtienne SicardAlexandre BoyerJean-Luc LevantChristian Marot et al.  Developing a Universal Exchange Format for Integrated Circuit Emission Model – Conducted Emissions
10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2015), Nov 2015, Edimburgh, United Kingdom. 6p
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hal-01225370v1  Conference papers
Etienne SicardAlexandre Boyer. EMC modeling of Integrated Circuits using IC-EMC
10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2015), Nov 2015, Edimburgh, United Kingdom. 2p
hal-01225377v1  Conference papers
Alexandre BoyerHe HuangSonia Ben Dhia. ANALYSIS AND MODELING OF PASSIVE DEVICE DEGRADATION FOR THE LONG-TERM ELECTROMAGNETIC EMISSION PREDICTION OF A DC-DC CONVERTER
10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2015), Nov 2015, Edimburgh, United Kingdom
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hal-01403875v1  Conference papers
Alexandre BoyerHe HuangSonia Ben Dhia. Predicting the risk of non-compliance to EMC requirements during the life-cycle
2016 Asia-Pacific International Symposium on Electromagnetic Compatibility and Signal Integrity (APEMC2016), May 2016, Shenzhen, China. pp.452 - 455, ⟨10.1109/APEMC.2016.7522766⟩
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hal-01403883v1  Conference papers
Chaimae GhfiriAlexandre BoyerAndré DurierSonia Ben DhiaC Marot. Construction d'un modèle ICEM pour prédire l'émission électromagnétique d'un FPGA
18e Colloque International et Exposition sur la Compatibilité Electromagnétique (CEM2016), Jul 2016, Rennes, France. 5p
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hal-01663667v2  Conference papers
Chaimae GhfiriAndré DurierAlexandre BoyerSonia Ben DhiaChristian Marot. Construction of an Integrated Circuit Emission Model of a FPGA
2016 Asia-Pacific International Symposium on Electromagnetic Compatibility and Signal Integrity (APEMC2016), May 2016, Shenzhen, China. pp.402-405, ⟨10.1109/APEMC.2016.7522751⟩