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hal-01663667v2  Conference papers
Chaimae GhfiriAndré DurierAlexandre BoyerSonia Ben DhiaChristian Marot. Construction of an Integrated Circuit Emission Model of a FPGA
2016 Asia-Pacific International Symposium on Electromagnetic Compatibility and Signal Integrity (APEMC2016), May 2016, Shenzhen, China. pp.402-405, ⟨10.1109/APEMC.2016.7522751⟩
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hal-01403874v1  Conference papers
Sonia Ben DhiaAlexandre Boyer. A Review of Research on the Effect of Aging on the EMC of Integrated Circuits
2016 Asia-Pacific International Symposium on Electromagnetic Compatibility and Signal Integrity (APEMC 2016), May 2016, Shenzhen, China. ⟨10.1109/APEMC.2016.7522971⟩
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hal-01403883v1  Conference papers
Chaimae GhfiriAlexandre BoyerAndré DurierSonia Ben DhiaC Marot. Construction d'un modèle ICEM pour prédire l'émission électromagnétique d'un FPGA
18e Colloque International et Exposition sur la Compatibilité Electromagnétique (CEM2016), Jul 2016, Rennes, France. 5p
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hal-01006121v1  Conference papers
Alexandre BoyerSonia Ben Dhia. Effect of Electrical Stresses on Digital Integrated Circuits Power Integrity
2013 17th IEEE Workshop on Signal and Power Integrity (SPI), May 2013, Paris, France. pp.1-4
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hal-01403886v1  Conference papers
Alexandre Boyer. AMELIORATION DE LA RESOLUTION SPATIALE DE SCAN CHAMP PROCHE EN INJECTION
18e Colloque International et Exposition sur la Compatibilité Electromagnétique CEM2016, Jul 2016, Rennes, France
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hal-01006115v1  Conference papers
Alexandre BoyerHe HuangSonia Ben Dhia. Impact of thermal aging on emission of a buck DC-DC converter
2014 International Symposium on Electromagnetic Compatibility, Tokyo (EMC'14/Tokyo), May 2014, Tokyo, Japan. pp.77-80
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hal-01006119v1  Conference papers
Jian-Fei WuJiancheng LiRongjun ShenAlexandre BoyerSonia Ben Dhia. Effect of Electrical Stresses on the Susceptibility of a Voltage regulator
EMC Symposium in Europe 2013 (EMC Europe 2013), Sep 2013, Bruges, Belgium. pp.113
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hal-01403868v1  Conference papers
Alexandre Boyer. Improving spatial resolution of immunity maps by post-processing
2016 Asia-Pacific International Symposium on Electromagnetic Compatibility and Signal Integrity (APEMC2016), May 2016, Shenzhen, China. pp.56 - 59, ⟨10.1109/APEMC.2016.7522794⟩
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hal-01698337v2  Conference papers
Andre DurierAlexandre BoyerG. Duchamp. A methodologic project to characterize and model COTS components EMC behavior after ageing
2016 Asia-Pacific International Symposium on Electromagnetic Compatibility and Signal Integrity (APEMC2016), May 2016, Shenzhen, China. pp.376 - 379, ⟨10.1109/APEMC.2016.7522742⟩
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hal-01403875v1  Conference papers
Alexandre BoyerHe HuangSonia Ben Dhia. Predicting the risk of non-compliance to EMC requirements during the life-cycle
2016 Asia-Pacific International Symposium on Electromagnetic Compatibility and Signal Integrity (APEMC2016), May 2016, Shenzhen, China. pp.452 - 455, ⟨10.1109/APEMC.2016.7522766⟩
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hal-01225352v1  Conference papers
He HuangAlexandre BoyerSonia Ben Dhia. Analysis and Modelling of Passive device degradation for a long-term electromagnetic emission study of a DC-DC converter
26th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2015), Oct 2015, Toulouse, France
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hal-01574387v2  Conference papers
Sébastien SerpaudChaimae GhfiriAlexandre BoyerA Durier. Proposal for combined conducted and radiated emission modelling for Integrated Circuit
11th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2017), Jul 2017, Saint-Petersbourg, Russia. pp.172-177, ⟨10.1109/EMCCompo.2017.7998105⟩
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hal-01159222v1  Conference papers
He HuangAlexandre BoyerSonia Ben DhiaBertrand Vrignon. Prediction of Aging Impact on Electromagnetic Susceptibility of an Operational Amplifier
Asia-Pacific International EMC Symposium 2015, May 2015, Taipei, Taiwan. 4p
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hal-01159220v1  Conference papers
Alexandre BoyerB VrignonManuel CavarrocJ Shepherd. Near-Field Injection At Die Level
Asia-Pacific International EMC Symposium 2015, May 2015, Taipei, Taiwan
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hal-01159221v1  Conference papers
Marc Veljko Thomas TomasevicAlexandre BoyerSonia Ben Dhia. Development of an On-Chip Sensor for Substrate Coupling Study in Smart Power Mixed ICs
Asia-Pacific International EMC Symposium 2015, May 2015, Taipei, Taiwan. 4p
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hal-01225324v1  Journal articles
Alexandre BoyerBertrand VrignonManuel Cavarroc. Modeling Magnetic Near-Field Injection at Silicon Die Level
IEEE Transactions on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers, 2015, 58 (1), pp. 257-269. ⟨10.1109/TEMC.2015.2486041⟩
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hal-00669519v1  Journal articles
Alexandre BoyerAmadou Ndoye CisseSonia Ben DhiaLaurent GuillotBertrand Vrignon. Characterization of the Evolution of IC Emissions after Accelerated Aging
IEEE Transactions on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers, 2009, 51 (4), pp.892. ⟨10.1109⟩
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hal-00937780v1  Journal articles
Jianfei WuAlexandre BoyerJiancheng LiSonia Ben DhiaRongjun Shen. Characterization of Changes in LDO Susceptibility after Electrical Stress
IEEE Transactions on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers, 2013, 55 (5), pp.883-890. ⟨10.1109/TEMC.2013.2242471⟩
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hal-01159232v1  Journal articles
Jianfei WuAlexandre BoyerJiancheng LiBertrand VrignonEtienne Sicard et al.  Modeling and Simulation of LDO Voltage Regulator Susceptibility to Conducted EMI
IEEE Transactions on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers, 2014, 56 (3), pp.726-735. ⟨10.1109/TEMC.2013.2294951⟩
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hal-01951615v1  Journal articles
Chaimae GhfiriAlexandre BoyerAlain BensoussanAndré DurierSonia Ben Dhia. A new methodology for EMC prediction of integrated circuits after aging
IEEE Transactions on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers, 2019, 61 (2), pp.572-581. ⟨10.1109/TEMC.2018.2819722⟩
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hal-01659770v1  Journal articles
Chaimae GhfiriAlexandre BoyerAndré DurierSonia Ben Dhia. A new methodology to build the Internal Activity Block of ICEM-CE for complex Integrated Circuits
IEEE Transactions on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers, 2018, 60 (5), pp.1500-1509. ⟨10.1109/TEMC.2017.2767084⟩
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hal-00937775v1  Journal articles
Alexandre BoyerSonia Ben DhiaBinhong LiNestor BerbelRaul Fernandez-Garcia. Experimental Investigations into the Effects of Electrical Stress on Electromagnetic Emission from Integrated Circuits
IEEE Transactions on Electromagnetic Compatibility, Institute of Electrical and Electronics Engineers, 2014, 56 (1), pp. 44-50. ⟨10.1109/TEMC.2013.2272195⟩
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hal-01574376v1  Conference papers
Alexandre BoyerManuel Antero Gonzalez SentisChaimae GhfiriAndré Durier. Modeling methodology of the conducted emission of a DC-DC converter board
11th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2017), Jul 2017, Saint-Petersbourg, Russia. pp.73-78, ⟨10.1109/EMCCompo.2017.7998085⟩
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hal-01574389v1  Conference papers
Nicolas LacrampeSebastien SerpaudAlexandre BoyerSéreirath Tran. Radiated suceptibility investigation of electronic board from near field scan method
11th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2017), Jul 2017, Saint-Petersbourg, Russia. pp.125-130, ⟨10.1109/EMCCompo.2017.7998096⟩
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hal-00669506v1  Journal articles
Raul Fernandez-GarciaIgnacio GilAlexandre BoyerSonia Ben DhiaBertrand Vrignon. A New Approach to Modeling the Impact of EMI on MOSFET DC Behavior
IEICE Transactions on Electronics, Institute of Electronics, Information and Communication Engineers, 2011, E94-C (12), pp.1906. ⟨10.1587⟩