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hal-01873753v1  Poster communications
David BourrierArnaud Durlach. COMPARISON OF THICK COPPER PLATING RESULTS WITH LABORATORY AND INDUSTRIAL ELECTROPLATING TOOLS
Journées Nationales sur les Technologies Emergentes en micro-nanofabrication (JNTE 2017), Oct 2017, Orléans, France. 1p., 2017
hal-00856168v1  Conference papers
Stéphane PinonDaouda Lamine DiedhiouAli BoukabacheVéronique ConédéraDavid Bourrier et al.  Fabrication and characterization of a fully integrated biosensor associating microfluidic device and RF circuit
IMS 2012 - Microwave Symposium Digest (MTT), 2012 IEEE MTT-S, Jun 2012, Montréal, Canada. pp.THPN-1 1330
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hal-00987976v1  Conference papers
Sébastien CargouMarc FouetArmelle MontroseDavid BourrierKarine Reybier et al.  AN INTEGRATED MAGNETIC PLANAR ACTUATOR REDEFINING MULTILEVEL (3D) MICROFLUIDIC STRATEGIES
10th International Conference on the Scientific and Clinical Applications of Magnetic Cerriers, Jun 2014, Dresden, Germany. pp63
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hal-01443073v1  Journal articles
Philippe ArtillanMagali BrunetDavid BourrierJean-Pierre LaurNicolas Mauran et al.  Integrated LC filter on silicon for DC-DC converter applications
IEEE Transactions on Power Electronics, Institute of Electrical and Electronics Engineers, 2011, 26 (8), pp.2319-2325. ⟨10.1109/TPEL.2010.2102776⟩
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hal-01871397v1  Conference papers
Ahmet LaleAuriane GrappinDavid BourrierLaurent MazenqAurélie Lecestre et al.  Design, realization and characterization of all-arround SiO2/Al2O3gate, suspended silicon nanowire chemical field effect transistors
19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS 2017), Jun 2017, Kaohsiung, Taiwan. 4p., ⟨10.1109/TRANSDUCERS.2017.7994346⟩
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hal-01326492v1  Conference papers
Aurélie LecestreAziliz LecomteDavid BourrierPascal DubreuilEmeline Descamps et al.  Plasma etching of thick Parylene C for fabrication of biocompatible electrodes
9th Workshop on Plasma Etch and Strip in Microtechnology (PESM2016), May 2016, Grenoble, France
hal-01873836v1  Conference papers
David BourrierMonique DilhanHugues GranierArnaud Durlach. Les dépôts électrolytiques appliqués aux micro-dispositifs au LAAS
Journée Toulousaine d'Electrochimie (JTE 2016), Jul 2016, Toulouse, France
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hal-00720570v1  Conference papers
Ayad GhannamLamine OurakDavid BourrierChristophe ViallonThierry Parra. Low Cost 3D Multilevel Interconnect Integration for RF and Microwave Applications
62nd Electronic Components and Technology Conference (ECTC 2012), May 2012, San Diego, United States. 5p
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hal-00627894v1  Conference papers
Ayad GhannamLamine OurakDavid BourrierChristophe ViallonThierry Parra. Efficient Low Cost Process For Single Step Metal Forming of 3D Interconnected Above-IC Inductors
41st European Solid-State Device Research Conference (ESSDERC 2011), Sep 2011, Helsinki, Finland. 4p
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