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hal-02324432v1  Conference papers
C. Villeneuve-FaureG. TeyssedreSéverine Le RoyL. BoudouK Makasheva. Interface properties in dielectrics: A cross-section analysis by atomic force microscopy
2018 12th International Conference on the Properties and Applications of Dielectric Materials (ICPADM), May 2018, Xi'an, China. pp.1135-1138, ⟨10.1109/ICPADM.2018.8401246⟩
hal-03092519v1  Conference papers
Marvine SoumboAdriana ScarangellaChristina Villeneuve-FaureCaroline BonafosAdnen Mlayah et al.  Organization dynamics during protein adsorption on thin silica layers containing silver nanoparticles
19th IEEE International Conference on Nanotechnology (IEEE NANO 2019), Jul 2019, Macau, Macau SAR China
hal-03092468v1  Conference papers
K MakashevaR BérardH SabbahK DemykC Joblin. Cosmic dust analogues in plasmas
International Conference on Energetic processing of large molecules and interstellar dust (EPoLM-4), Mar 2019, Madrid, Spain
hal-02448461v1  Journal articles
Christina Villeneuve-FaureLaurent BoudouK MakashevaG. Teyssedre. Atomic force microscopy developments for probing space charge at sub-micrometer scale in thin dielectric films
IEEE Transactions on Dielectrics and Electrical Insulation, Institute of Electrical and Electronics Engineers, 2016, 23 (2), pp.713-720. ⟨10.1109/TDEI.2016.005319⟩
hal-03092475v1  Conference papers
K MakashevaMarvine SoumboAdriana ScarangellaChristina Villeneuve-FaureCaroline Bonafos et al.  AgNPs embedded in silica matrix: a way to impair the microbial adhesion on dielectric surfaces
15th IEEE International Conference on Nano/Micro Engineered & Molecular Systems (IEEE NEMS 2020), Sep 2020, San Diego, United States
hal-03092511v1  Conference papers
L MartocqP ChevallierM LaurentG LarocheK Makasheva. Study of fibronectin adsorption on plasma-enhanced deposition of silver nanoparticles embedded in a silica matrix
35th Annual Meeting of the Canadian Biomaterials Society, May 2019, Quebec city, Canada
hal-01053188v1  Conference papers
G. TeyssedreChristina VilleneuvePatrick PonsLaurent BoudouK Makasheva et al.  Challenges in probing space charge at sub-micrometer scale
Electrical Insulation and Dielectric Phenomena (CEIDP), Oct 2012, Montreal, Canada. 5 p
hal-02324437v1  Conference papers
G. TeyssedreS. LiK MakashevaN. ZhaoC. Laurent. Interface tailoring for charge injection mitigation in insulators: Different principles and achievements
2018 12th International Conference on the Properties and Applications of Dielectric Materials (ICPADM), May 2018, Xi'an, China. pp.17-21, ⟨10.1109/ICPADM.2018.8401277⟩
hal-02324440v1  Conference papers
K MakashevaM. BelhajG. TeyssedreC. RigoudyS. Dadouch et al.  On the secondary electron emission phenomenon when originating from very thin layers
2017 IEEE 17th International Conference on Nanotechnology (IEEE-NANO), Jul 2017, Pittsburgh, United States. pp.515-516, ⟨10.1109/NANO.2017.8117275⟩
hal-02324471v1  Conference papers
F. MortreuilC. Villeneuve-FaureL. BoudouK MakashevaG. Teyssedre. Charges injection investigation at metal/dielectric interfaces by Kelvin Probe Force Microscopy
2016 IEEE International Conference on Dielectrics (ICD), Jul 2016, Montpellier, France. pp.493-496, ⟨10.1109/ICD.2016.7547650⟩
hal-02940243v1  Conference papers
K MakashevaL. MontanariA. ScarangellaG. Teyssedre. Plasmon induced enhancement of the electroluminescence signal of thin insulating polypropylene films
2020 IEEE 20th International Conference on Nanotechnology (IEEE-NANO), Jul 2020, Montreal (Virtual), Canada. pp.44-47, ⟨10.1109/NANO47656.2020.9183435⟩
hal-00670156v1  Conference papers
K MakashevaBernard DespaxLaurent BoudouG. TeyssedreL. Ressier et al.  Dielectric layers with gradual properties
IEEE International Conference on Solid Dielectrics, Jul 2010, Potsdam, Germany. 4 p