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hal-02089708v1  Conference papers
Philippe MeniniG. BlasquezPatrick PonsC DouziechP Favaro et al.  Optimization of a BiCMOS integrated tranducer for self-compensated capacitive pressure sensor
ICECS'99, IEEE International Conference on Electronics, Circuits and Systems, Sep 1999, Paphos, Cyprus
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hal-02170328v1  Conference papers
G BlasquezX ChauffleurPatrick PonsC DouziechP Favaro et al.  Thermal Drift and Chip Size in Capacitive Pressure Sensors
Eurosensors XIII, Sep 1999, La Haye, Netherlands. pp.461-464
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hal-02170319v1  Conference papers
E Saint EtienneG BlasquezPatrick PonsRobert PlanaC Douziech et al.  New Technological advances for microshielded coplanar circuits on silicon
Micro Mechanics Europe (MME1999), Sep 1999, Gif-sur-Yvette, France. pp.109-111
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hal-00452485v1  Conference papers
Ayad GhannamChristophe ViallonDavid BourrierThierry Parra. CARACTERISATION MICRO-ONDE DE LA RESINE EPAISSE SU8 UTILISEE DANS UN PROCEDE "ABOVE-IC
11èmes JOURNÉES DE CARACTÉRISATION MICROONDES ET MATÉRIAUX, Mar 2010, Brest, France. pp.4
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hal-00591690v1  Conference papers
Ayad GhannamDavid BourrierChristophe ViallonThierry Parra. Low Cost SU8 Based Above IC Process for High-Q RF Power Inductors Integration
Mediterranean Conference on Innovative Materials and Applications - CIMA 2011, Mar 2011, Beyrouth, Lebanon. 4p
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hal-00627894v1  Conference papers
Ayad GhannamLamine OurakDavid BourrierChristophe ViallonThierry Parra. Efficient Low Cost Process For Single Step Metal Forming of 3D Interconnected Above-IC Inductors
41st European Solid-State Device Research Conference (ESSDERC 2011), Sep 2011, Helsinki, Finland. 4p
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hal-00720570v1  Conference papers
Ayad GhannamLamine OurakDavid BourrierChristophe ViallonThierry Parra. Low Cost 3D Multilevel Interconnect Integration for RF and Microwave Applications
62nd Electronic Components and Technology Conference (ECTC 2012), May 2012, San Diego, United States. 5p
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hal-00907835v1  Conference papers
Alessandro MagnaniChristophe ViallonIoan BurciuThomas EpertMattia Borgarino et al.  A K-band BiCMOS Low duty-cycle Resistive Mixer
IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF 2014), Jan 2014, Newport Beach, United States
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hal-01015086v1  Journal articles
Christophe ViallonGrégory MénéghinThierry Parra. NMOS Device Optimization for the Design of a W-band Double-Balanced Resistive Mixer
IEEE Microwave and Wireless Components Letters, Institute of Electrical and Electronics Engineers, 2014, 24 (9), pp. 637-639. ⟨10.1109/LMWC.2014.2332100⟩
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hal-01198618v1  Conference papers
Olga BushuevaAyad GhannamChristophe ViallonThierry Parra. Pertes par rayonnement lors de la caractérisation sous pointes d'inductances à fort Q
19èmes Journées Nationales Microondes (JNM), Jun 2015, BORDEAUX, France
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hal-01370500v1  Journal articles
Olga BushuevaChristophe ViallonAyad GhannamThierry Parra. On-Wafer Measurement Errors Due to Unwanted Radiations on High-Q Inductors
IEEE Transactions on Microwave Theory and Techniques, Institute of Electrical and Electronics Engineers, 2016, 64 (9), pp.2905-2911. ⟨10.1109/TMTT.2016.2588486⟩
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hal-01702868v1  Conference papers
Olga BushuevaAyad GhannamAlessandro MagnaniAudrey CayronChristophe Viallon et al.  Solénoïdes 3D compacts pour applications RF
20èmes Journées Nationales Micro-Ondes, May 2017, Saint-Malo, France
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hal-01702744v1  Conference papers
Audrey CayronOlga BushuevaAyad GhannamAlessandro MagnaniChristophe Viallon et al.  Transformateurs d'impédance 3D compacts adaptés pour applications RF et microondes
20èmes Journées Nationales Micro-Ondes (JNM 2017), May 2017, Saint-Malo, France
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hal-01778992v3  Journal articles
Audrey CayronChristophe ViallonOlga BushuevaAyad GhannamThierry Parra. High-Performance Compact 3-D Solenoids for RF Applications
IEEE Microwave and Wireless Components Letters, Institute of Electrical and Electronics Engineers, 2018, 28 (6), pp.479-481. ⟨10.1109/LMWC.2018.2831438⟩