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hal-01074511v1
Conference papers
Eid E., Thierry Lacrevaz, Cédric Bermond, Rivaz S. De, Capraro S. et al. “Characterization and Modelling of Substrate Coupling Effects in 3D Integrated Circuit Stacking” Materials for Advanced Metallization, March 7-10, 2010, Mechelen, Belgium.Materials for Advanced Metallization, Mechelen, Belgium., Mar 2010, Mechelen, Belgium
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