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hal-01197043v1  Conference papers
Chenjiang YuCyril ButtayEric LabouréVincent BleyCéline Combettes. Highly integrated power electronic converters using active devices embedded in printed-circuit board
4th Micro/Nano-Electronics, packaging and assembling, design and manufacturing forum MiNaPAD 2015, IMAPS, Apr 2015, Grenoble, France
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hal-01207014v1  Journal articles
Bassem MouawadBenoit ThollinCyril ButtayLaurent DupontVincent Bley et al.  Direct Copper Bonding for Power Interconnects: Design, Manufacturing, and Test
IEEE Transactions on Components, Packaging and Manufacturing Technology. Part A, Manufacturing Technology, Institute of Electrical and Electronics Engineers (IEEE), 2015, 5 (1), pp.143-150. ⟨10.1109/TCPMT.2014.2376882⟩
hal-01081697v1  Conference papers
Raphaël RivaCyril ButtayRémi PerrinMarie-Laure LocatelliVincent Bley et al.  3D Packaging Structure for High Temperature Power electronics
From Nano to Micro Power Electronics and Packaging Workshop, IMAPS France, Oct 2014, Tours, France
hal-02405800v1  Conference papers
Vincent BleyCyril ButtayDenis LabrousseMickael PetitBojan Djuric et al.  Die Interconnection for Power Module 3.0
ECPE Workshop "Power Module 2.0", Oct 2019, Hambourg, Germany
hal-01373062v1  Conference papers
Cyril ButtayChenjiang YuEric LabouréVincent BleyCéline Combettes. EDT for Power Devices
Embedded Device Technology: “Disappearing Die – Embed your Chips”, IMAPS - NMI, Sep 2016, Caldicot, United Kingdom
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hal-02492270v1  Conference papers
Marie-Laure LocatelliKarine IsoirdS. DinculescuVincent BleyThierry Lebey et al.  Study of suitable dielectric material properties for high electric field and high temperature power semiconductor environment
10th European Conference on Power Electronics and Applications (EPE'2003), Sep 2003, Toulouse, France
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hal-00476271v1  Journal articles
Ludovic MénagerMaher SoueidanBruno AllardVincent BleyBenoît Schlegel. A Lab-Scale Alternative Interconnection Solution of Semiconductor Dice Compatible with Power Modules 3-D Integration
IEEE Transactions on Power Electronics, Institute of Electrical and Electronics Engineers, 2010, 25 (7), pp.1667 - 1670. ⟨10.1109/TPEL.2010.2041557⟩
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hal-00672244v1  Journal articles
Bassem MouawadMaher SoueidanD. FabrègueCyril ButtayBruno Allard et al.  Application of the Spark Plasma Sintering Technique to Low-Temperature Copper Bonding
IEEE Transactions on Components and Packaging Technologies, Institute of Electrical and Electronics Engineers, 2012, 2 (4), pp.553 - 560. ⟨10.1109/TCPMT.2012.2186453⟩
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hal-00707782v1  Journal articles
Bassem MouawadMaher SoueidanD. FabrègueCyril ButtayVincent Bley et al.  Full densification of Molybdenum powders using Spark Plasma Sintering
Metallurgical and Materials Transactions A, Springer Verlag/ASM International, 2012, pp.1-8. ⟨10.1007/s11661-012-1144-2⟩