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hal-00452485v1  Conference papers
Ayad GhannamChristophe ViallonDavid BourrierThierry Parra. CARACTERISATION MICRO-ONDE DE LA RESINE EPAISSE SU8 UTILISEE DANS UN PROCEDE "ABOVE-IC
11èmes JOURNÉES DE CARACTÉRISATION MICROONDES ET MATÉRIAUX, Mar 2010, Brest, France. pp.4
hal-01873836v1  Conference papers
David BourrierMonique DilhanHugues GranierArnaud Durlach. Les dépôts électrolytiques appliqués aux micro-dispositifs au LAAS
Journée Toulousaine d'Electrochimie (JTE 2016), Jul 2016, Toulouse, France
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hal-01871397v1  Conference papers
Ahmet LaleAuriane GrappinDavid BourrierLaurent MazenqAurélie Lecestre et al.  Design, realization and characterization of all-arround SiO2/Al2O3gate, suspended silicon nanowire chemical field effect transistors
19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS 2017), Jun 2017, Kaohsiung, Taiwan. 4p., ⟨10.1109/TRANSDUCERS.2017.7994346⟩
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hal-01443073v1  Journal articles
Philippe ArtillanMagali BrunetDavid BourrierJean-Pierre LaurNicolas Mauran et al.  Integrated LC filter on silicon for DC-DC converter applications
IEEE Transactions on Power Electronics, Institute of Electrical and Electronics Engineers, 2011, 26 (8), pp.2319-2325. ⟨10.1109/TPEL.2010.2102776⟩
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hal-00720570v1  Conference papers
Ayad GhannamLamine OurakDavid BourrierChristophe ViallonThierry Parra. Low Cost 3D Multilevel Interconnect Integration for RF and Microwave Applications
62nd Electronic Components and Technology Conference (ECTC 2012), May 2012, San Diego, United States. 5p
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hal-01326492v1  Conference papers
Aurélie LecestreAziliz LecomteDavid BourrierPascal DubreuilEmeline Descamps et al.  Plasma etching of thick Parylene C for fabrication of biocompatible electrodes
9th Workshop on Plasma Etch and Strip in Microtechnology (PESM2016), May 2016, Grenoble, France
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hal-01873753v1  Poster communications
David BourrierArnaud Durlach. COMPARISON OF THICK COPPER PLATING RESULTS WITH LABORATORY AND INDUSTRIAL ELECTROPLATING TOOLS
Journées Nationales sur les Technologies Emergentes en micro-nanofabrication (JNTE 2017), Oct 2017, Orléans, France. 1p., 2017
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hal-00627894v1  Conference papers
Ayad GhannamLamine OurakDavid BourrierChristophe ViallonThierry Parra. Efficient Low Cost Process For Single Step Metal Forming of 3D Interconnected Above-IC Inductors
41st European Solid-State Device Research Conference (ESSDERC 2011), Sep 2011, Helsinki, Finland. 4p
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