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Environmental ageing of aerospace epoxy adhesive in bonded assembly configuration Journal of Thermal Analysis and Calorimetry, Springer Verlag, 2013, vol. 114 (n° 2), pp. 621-628. ⟨10.1007/s10973-013-3009-3⟩ |
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hal-00840784v1
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New bonded assembly configuration for dynamic mechanical analysis of adhesives International Journal of Adhesion and Adhesives, Elsevier, 2013, vol. 46, pp.1-6. ⟨10.1016/j.ijadhadh.2013.05.011⟩ |
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hal-00950219v1
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Enthalpy relaxation phenomena of epoxy adhesive in operational configuration: Thermal, mechanical and dielectric analyses Journal of Non-Crystalline Solids, Elsevier, 2014, vol. 387, pp. 57-61. ⟨10.1016/j.jnoncrysol.2013.12.028⟩ |
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