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hal-02324370v1  Conference papers
Kemas TofaniJean-Pascal CambronneS. DinculescuNgapuli SinisukaK Makasheva. Methodology for Analysis of Electrical Breakdown In Micrometer gaps in Tip-To-Plane Configuration
2018 IEEE 13th Nanotechnology Materials and Devices Conference (NMDC), Oct 2018, Portland, United States. pp.1-4, ⟨10.1109/NMDC.2018.8605855⟩
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hal-03147727v1  Conference papers
Laurine MartocqPascale ChevallierMorgane LaurentGaetan LarocheK Makasheva. INFLUENCE OF PLASMA-DEPOSITED COATING OF SILVER NANOPARTICLES EMBEDDED IN A SiOC:H MATRIX ON THE ADSORPTION OF FIBRONECTIN
28th Annual Conference of Biomaterials in Medicine and Veterinary Medicine, Oct 2019, Rytro, Poland. pp.53
hal-02324475v1  Conference papers
M. BelhajK MakashevaG. TeyssedreD. Payan. Effect of charging on the secondary electron emission
2016 IEEE International Conference on Plasma Science (ICOPS), Jun 2016, Banff, Canada. pp.1-1, ⟨10.1109/PLASMA.2016.7534063⟩
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hal-02448461v1  Journal articles
Christina Villeneuve-FaureLaurent BoudouK MakashevaG. Teyssedre. Atomic force microscopy developments for probing space charge at sub-micrometer scale in thin dielectric films
IEEE Transactions on Dielectrics and Electrical Insulation, Institute of Electrical and Electronics Engineers, 2016, 23 (2), pp.713-720. ⟨10.1109/TDEI.2016.005319⟩
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hal-03092482v1  Conference papers
Aditya PurbaAntoine BelingerJean-Pascal CambronneNgapuli SinisukaK Makasheva. Reliable method for accurate measurements of the breakdown voltage in microgaps
IEEE Conference on Electrical Insulation and Dielectric Phenomena (IEEE CEIDP 2020), Oct 2020, East Rutherford, United States
hal-01763541v1  Conference papers
K MakashevaCaroline Bonafos. IEEE NMDC 2016 General Chair's Letter
Nanotechnology Materials and Devices Conference (NMDC), 2016 IEEE, 2016, Toulouse, France. ⟨10.1109/NMDC.2016.7777056⟩
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hal-03092475v1  Conference papers
K MakashevaMarvine SoumboAdriana ScarangellaChristina Villeneuve-FaureCaroline Bonafos et al.  AgNPs embedded in silica matrix: a way to impair the microbial adhesion on dielectric surfaces
15th IEEE International Conference on Nano/Micro Engineered & Molecular Systems (IEEE NEMS 2020), Sep 2020, San Diego, United States
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hal-02940243v1  Conference papers
K MakashevaL. MontanariAdriana ScarangellaG. Teyssedre. Plasmon induced enhancement of the electroluminescence signal of thin insulating polypropylene films
2020 IEEE 20th International Conference on Nanotechnology (IEEE-NANO), Jul 2020, Montreal (Virtual), Canada. pp.44-47, ⟨10.1109/NANO47656.2020.9183435⟩
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hal-03003165v1  Conference papers
Charles RigoudyK MakashevaMohamed BelhajSarah DadouchG. Teyssedre et al.  Rational Engineering of the Dielectric Properties of Thin Silica Layers with a Single Plane of AgNPs
IEEE Internat. Conf. on Dielectrics (ICD), Valencia, Spain, 5-9 July 2020, Jul 2020, Valencia, Spain. pp. 205-208