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hal-02324370v1  Conference papers
Kemas TofaniJean-Pascal CambronneS. DinculescuNgapuli SinisukaK Makasheva. Methodology for Analysis of Electrical Breakdown In Micrometer gaps in Tip-To-Plane Configuration
2018 IEEE 13th Nanotechnology Materials and Devices Conference (NMDC), Oct 2018, Portland, United States. pp.1-4, ⟨10.1109/NMDC.2018.8605855⟩
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hal-03147727v1  Conference papers
Laurine MartocqPascale ChevallierMorgane LaurentGaetan LarocheK Makasheva. INFLUENCE OF PLASMA-DEPOSITED COATING OF SILVER NANOPARTICLES EMBEDDED IN A SiOC:H MATRIX ON THE ADSORPTION OF FIBRONECTIN
28th Annual Conference of Biomaterials in Medicine and Veterinary Medicine, Oct 2019, Rytro, Poland. pp.53
hal-02324475v1  Conference papers
M. BelhajK MakashevaG. TeyssedreD. Payan. Effect of charging on the secondary electron emission
2016 IEEE International Conference on Plasma Science (ICOPS), Jun 2016, Banff, Canada. pp.1-1, ⟨10.1109/PLASMA.2016.7534063⟩
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hal-02448461v1  Journal articles
Christina Villeneuve-FaureLaurent BoudouK MakashevaG. Teyssedre. Atomic force microscopy developments for probing space charge at sub-micrometer scale in thin dielectric films
IEEE Transactions on Dielectrics and Electrical Insulation, Institute of Electrical and Electronics Engineers, 2016, 23 (2), pp.713-720. ⟨10.1109/TDEI.2016.005319⟩
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hal-03092482v1  Conference papers
Aditya PurbaAntoine BelingerJean-Pascal CambronneNgapuli SinisukaK Makasheva. Reliable method for accurate measurements of the breakdown voltage in microgaps
IEEE Conference on Electrical Insulation and Dielectric Phenomena (IEEE CEIDP 2020), Oct 2020, East Rutherford, United States
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hal-03092475v1  Conference papers
K MakashevaMarvine SoumboAdriana ScarangellaChristina Villeneuve-FaureCaroline Bonafos et al.  AgNPs embedded in silica matrix: a way to impair the microbial adhesion on dielectric surfaces
15th IEEE International Conference on Nano/Micro Engineered & Molecular Systems (IEEE NEMS 2020), Sep 2020, San Diego, United States
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hal-02940243v1  Conference papers
K MakashevaL. MontanariAdriana ScarangellaG. Teyssedre. Plasmon induced enhancement of the electroluminescence signal of thin insulating polypropylene films
2020 IEEE 20th International Conference on Nanotechnology (IEEE-NANO), Jul 2020, Montreal (Virtual), Canada. pp.44-47, ⟨10.1109/NANO47656.2020.9183435⟩
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hal-03092511v1  Conference papers
Laurine MartocqP ChevallierM LaurentG LarocheK Makasheva. Study of fibronectin adsorption on plasma-enhanced deposition of silver nanoparticles embedded in a silica matrix
35th Annual Meeting of the Canadian Biomaterials Society, May 2019, Quebec city, Canada
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hal-02324437v1  Conference papers
G. TeyssedreS. LiK MakashevaN. ZhaoChristian Laurent. Interface tailoring for charge injection mitigation in insulators: Different principles and achievements
2018 12th International Conference on the Properties and Applications of Dielectric Materials (ICPADM), May 2018, Xi'an, China. pp.17-21, ⟨10.1109/ICPADM.2018.8401277⟩
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hal-02324322v1  Journal articles
G. TeyssedreS. LiK MakashevaN. ZhaoLaurent Millière et al.  Interface tailoring for charge injection control in polyethylene
IEEE Transactions on Dielectrics and Electrical Insulation, Institute of Electrical and Electronics Engineers, 2017, 24 (3), pp.1319-1330. ⟨10.1109/TDEI.2017.006142⟩
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hal-02324440v1  Conference papers
K MakashevaM. BelhajG. TeyssedreCharles RigoudyS. Dadouch et al.  On the secondary electron emission phenomenon when originating from very thin layers
2017 IEEE 17th International Conference on Nanotechnology (IEEE-NANO), Jul 2017, Pittsburgh, United States. pp.515-516, ⟨10.1109/NANO.2017.8117275⟩
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hal-02324432v1  Conference papers
Christina Villeneuve-FaureG. TeyssedreSéverine Le RoyLaurent BoudouK Makasheva. Interface properties in dielectrics: A cross-section analysis by atomic force microscopy
2018 12th International Conference on the Properties and Applications of Dielectric Materials (ICPADM), May 2018, Xi'an, China. pp.1135-1138, ⟨10.1109/ICPADM.2018.8401246⟩