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Characterization and modeling of electrical stresses on digital integrated circuits power integrity and conducted emission

Alexandre Boyer 1 Sonia Ben Dhia 1
1 LAAS-ESE - Équipe Énergie et Systèmes Embarqués
LAAS - Laboratoire d'analyse et d'architecture des systèmes
Abstract : Recent studies have shown that integrated circuit aging modifies electromagnetic emission significantly. The proposed paper aims at evaluating the impact of aging on the power integrity and the conducted emission of digital integrated circuits, clarifying the origin of electromagnetic emission evolution and proposing a methodology to predict this evolution. On-chip measurements of power supply voltage bounces in a CMOS 90 nm technology test chip and conducted emission measurements are combined with electric stress to characterize the influence of aging. Simulations based on ICEM modeling modified by an empirical coefficient to model the evolution of the emission induced by device aging is proposed and tested.
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Submitted on : Monday, February 17, 2014 - 1:11:09 PM
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Alexandre Boyer, Sonia Ben Dhia. Characterization and modeling of electrical stresses on digital integrated circuits power integrity and conducted emission. 2013 9th Intl Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC Compo 2013), Dec 2013, Nara, Japan. pp.190-195, ⟨10.1109/EMCCompo.2013.6735199⟩. ⟨hal-00945301⟩

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