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Caractérisation thermomécanique de films métalliques déposés en couche mince pour la simulation de la fiabilité de composants microélectroniques de puissance

Jean-Baptiste Sauveplane 1
1 LAAS-ISGE - Équipe Intégration de Systèmes de Gestion de l'Énergie
LAAS - Laboratoire d'analyse et d'architecture des systèmes
Abstract : Thermomechanical simulation of power device is strongly dependent on the precise knowledge of mechanical properties of materials, that composed the device, such as Young modulus and coefficient of thermal expansion. Usually material parameters that are available from data bases refer to bulk material and their variation with temperature and number of fatigue cycles are not given. Our works deal with the development of a methodology for thermomecanical characterization of thin film's materials properties thanks to curvature measurement of bi-layer cantilever microsystem subjected to temperature variation. Young modulus and coefficient of thermal expansion of a 4µm and a 10µm thick aluminium film deposited by DC magnetron sputtering were measured precisely. Cantilever microsystems were also excited at their resonant frequency by harmonic vibration in order to characterise Young modulus variation with number of fatigue cycles. Mechanical properties of materials determined previously were then injected in a finite element model of an ultra low on state resistance power device from Freescale Semiconductor. Electro-thermo-mechanical simulations were done in order to evaluate the impact of connexion between the power die and the package on temperature distribution and stress generate in material.
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Submitted on : Wednesday, June 27, 2007 - 3:58:18 PM
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  • HAL Id : tel-00158019, version 1

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Jean-Baptiste Sauveplane. Caractérisation thermomécanique de films métalliques déposés en couche mince pour la simulation de la fiabilité de composants microélectroniques de puissance. Micro et nanotechnologies/Microélectronique. INSA de Toulouse, 2007. Français. ⟨tel-00158019⟩

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